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BL1-04

1ABRIDGERECTIFIERS

FRONTIER

Frontier Electronics

CBRLD1-04

SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CBRLD1-04

SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMMR1-04

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1.0AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04

GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS

DESCRIPTION: TheCENTRALSEMICONDUCTOR1.0AmpSurfaceMountSiliconRectifierisahighquality,wellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplications.Toorderdeviceson12mmTapeandReel(3000

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04M

GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS

DESCRIPTION: TheCENTRALSEMICONDUCTORCMR1-02Mseries1.0Ampsurfacemountsiliconrectifierisawellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplicationswheresmallsizeisrequired.TheSMAcas

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04M

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04M

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04

SURFACEMOUNTGENERALPURPOSERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04C

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

HS-QSFP-P1-04

FLYOVER?QSFPCABLEASSEMBLIES

Samtec

Samtec, Inc

詳細(xì)參數(shù)

  • 型號(hào):

    JA1-04-J

  • 功能描述:

    端子 JUMPER/CONTACT

  • RoHS:

  • 制造商:

    AVX

  • 產(chǎn)品:

    Junction Box - Wire to Wire

  • 系列:

    9826

  • 線規(guī):

    26-18

  • 顏色:

    Red

  • 型式:

    Female

  • 觸點(diǎn)電鍍:

    Tin over Nickel

  • 觸點(diǎn)材料:

    Beryllium Copper, Phosphor Bronze

  • 端接類型:

    Crimp

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
NXP/恩智浦
23+
SOP-8
5000
一級(jí)代理原廠VIP渠道,專注軍工、汽車、醫(yī)療、工業(yè)、
詢價(jià)
NXP
1651+
SOP-8
7500
只做原裝進(jìn)口,假一罰十
詢價(jià)
TI
22+
VQFN
9850
只做原裝正品假一賠十!正規(guī)渠道訂貨!
詢價(jià)
Eaton
22+
NA
168
加我QQ或微信咨詢更多詳細(xì)信息,
詢價(jià)
NAZOMI
2021+
TFBGA
100500
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨
詢價(jià)
NXP/恩智浦
21+
SSOP-20
5000
原裝現(xiàn)貨/假一賠十/支持第三方檢驗(yàn)
詢價(jià)
ST
22+
New
16900
支持樣品 原裝現(xiàn)貨 提供技術(shù)支持!
詢價(jià)
ASTEC
21+
35200
一級(jí)代理/放心采購(gòu)
詢價(jià)
ASTEC
2023+環(huán)保現(xiàn)貨
標(biāo)準(zhǔn)封裝
2500
專注軍工、汽車、醫(yī)療、工業(yè)等方案配套一站式服務(wù)
詢價(jià)
ASTEC
2023+
SMD
11475
安羅世紀(jì)電子只做原裝正品貨
詢價(jià)
更多JA1-04-J供應(yīng)商 更新時(shí)間2024-11-20 16:31:00