M14C16DD中文資料意法半導體數(shù)據(jù)手冊PDF規(guī)格書

Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and vertical axis, measured in μm).

PRODUCT M14C16

■ WAFER SIZE 152 mm (6 inches)

■ DIE IDENTIFICATION M14C16KA_R

■ DIE SIZE (X x Y) 1390 x 2375 μm

■ SCRIBE LINE 101.8 x 102.4 μm

■ PAD OPENING 100 x 100 μm

DIE LAYOUT

■ DI Die Identification (at the position shown in Figure 1)

■ C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)

■ C4, C6, C8 These ISO pins do not appear on the M14C16 die

■ NC This pad, shown in Figure 1, is Not Connected