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MA4BPS101中文資料MACOM數(shù)據手冊PDF規(guī)格書

MA4BPS101
廠商型號

MA4BPS101

功能描述

PIN Diode Chips with Offset Bond Pads

文件大小

83.94 Kbytes

頁面數(shù)量

4

生產廠商 Tyco Electronics
企業(yè)簡稱

MACOM

中文名稱

Tyco Electronics官網

原廠標識
數(shù)據手冊

下載地址一下載地址二到原廠下載

更新時間

2025-1-16 18:32:00

MA4BPS101規(guī)格書詳情

Description

These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC? process. They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges. The large pads allow use of multiple bond wires. The location of these pads on a glass substrate results in low parasitic capacitance. The diode junction is passivated with silicon nitride and a layer of polyimide has been added for scratch protection during assembly. The devices are available on industry standard tape frame for automatic insertion and assembly in high volume applications.

Features

? Bond Pads Removed From Active Junction

? Large Bond Pads Support Multiple Bond Wires

? Rugged Silicon-Glass Construction

? Silicon Nitride Passivation

? Polyimide Scratch Protection

產品屬性

  • 型號:

    MA4BPS101

  • 制造商:

    M/A-COM Technology Solutions

  • 功能描述:

    PIN ATTENUATOR/SWIT 70V 2PIN ODS-1244 - Bulk

供應商 型號 品牌 批號 封裝 庫存 備注 價格
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