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MO136-A

LED SINGLE DIGIT DISPLAY

LEDSINGLEDIGITDISPLAY SEVENSEGMENTNUMERICDISPLASYS

MICRO-ELECTRONICS

Micro Electronics

MO136-C

LED SINGLE DIGIT DISPLAY

LEDSINGLEDIGITDISPLAY SEVENSEGMENTNUMERICDISPLASYS

MICRO-ELECTRONICS

Micro Electronics

MO139A

0.39 SINGLE DIGIT NUMERIC DISPLAYS

0.39SINGLEDIGITNUMERICDISPLAYS

MICRO-ELECTRONICS

Micro Electronics

MO139C

0.39 SINGLE DIGIT NUMERIC DISPLAYS

0.39SINGLEDIGITNUMERICDISPLAYS

MICRO-ELECTRONICS

Micro Electronics

MO141A

0.4 SINGLE DIGIT NUMERIC DISPLAYS

0.4SINGLEDIGITNUMERICDISPLAYS

MICRO-ELECTRONICS

Micro Electronics

MO141C

0.4 SINGLE DIGIT NUMERIC DISPLAYS

0.4SINGLEDIGITNUMERICDISPLAYS

MICRO-ELECTRONICS

Micro Electronics

MO-192

The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Packageheightdownto0.6mm Design,assemblyandtestcapabilitiesthatenablestackingcombinationsofmemory,logicandmixedsignaltypedevices EstablishedpackageinfrastructurewithstandardCABGAandfcCSPfootprints Consistentproductperformancewithhighyieldsandrel

amkor

Amkor Technology

MO-195

The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Packageheightdownto0.6mm Design,assemblyandtestcapabilitiesthatenablestackingcombinationsofmemory,logicandmixedsignaltypedevices EstablishedpackageinfrastructurewithstandardCABGAandfcCSPfootprints Consistentproductperformancewithhighyieldsandrel

amkor

Amkor Technology

MO-216

The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Packageheightdownto0.6mm Design,assemblyandtestcapabilitiesthatenablestackingcombinationsofmemory,logicandmixedsignaltypedevices EstablishedpackageinfrastructurewithstandardCABGAandfcCSPfootprints Consistentproductperformancewithhighyieldsandrel

amkor

Amkor Technology

MO-219

The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Packageheightdownto0.6mm Design,assemblyandtestcapabilitiesthatenablestackingcombinationsofmemory,logicandmixedsignaltypedevices EstablishedpackageinfrastructurewithstandardCABGAandfcCSPfootprints Consistentproductperformancewithhighyieldsandrel

amkor

Amkor Technology

替換型號

詳細參數(shù)

  • 型號：

    MO

  • 制造商：

    UNBRANDED

  • 功能描述：

    MODEM INTERNAL 56K PCI

供應商型號品牌批號封裝庫存備注價格
TI
2021
BGA
1000
全新、原裝
 詢價
TOSHIBA/東芝
22+
SOT-89
20000
保證原裝正品,假一陪十
 詢價
TOSHIBA/東芝
22+
SOT-89
100000
代理渠道/只做原裝/可含稅
 詢價
XX
23+
SOT-234
50000
全新原裝正品現(xiàn)貨,支持訂貨
 詢價
XX
23+
NA/
12250
原裝現(xiàn)貨,當天可交貨,原型號開票
 詢價
23+
NA
16567
正品:QQ;2987726803
 詢價
MOTO
22+
SOT323
25000
只有原裝原裝,支持BOM配單
 詢價
聯(lián)發(fā)科技MTK)
23+
集成電路IC-PROC,,
6000
原裝,現(xiàn)貨
 詢價
NVIDIA
2023+
BGA
1
AI智能識別、工業(yè)、汽車、醫(yī)療方案LPC批量及配套一站
 詢價
FAIRCHILD/仙童
23+
SOT-23
15000
全新原裝現(xiàn)貨,價格優(yōu)勢
 詢價
更多MO供應商 更新時間2025-4-6 16:00:00

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