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RD28F3208C3B70中文資料英特爾數(shù)據(jù)手冊PDF規(guī)格書
廠商型號 |
RD28F3208C3B70 |
功能描述 | 3 VOLT INTEL AdvancedBootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye |
文件大小 |
1.22334 Mbytes |
頁面數(shù)量 |
70 頁 |
生產(chǎn)廠商 | Intel Corporation(Integrated Electronics Corporation) |
企業(yè)簡稱 |
Intel【英特爾】 |
中文名稱 | 英特爾(美國科技公司)官網(wǎng) |
原廠標識 | |
數(shù)據(jù)手冊 | |
更新時間 | 2024-11-19 22:59:00 |
RD28F3208C3B70規(guī)格書詳情
Introduction
This document contains the specifications for the Intel? Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in the following combinations:
? 32-Mbit flash + 8-Mbit SRAM
? 32-Mbit flash + 4-Mbit SRAM
? 16-Mbit flash + 4-Mbit SRAM
? 16-Mbit flash memory + 2-Mbit SRAM
Product Overview
The C3 SCSP device combines flash memory and SRAM into a single package, which provides secure low-voltage memory solutions for portable applications.
The flash memory provides the following features:
? Enhanced security.
? Instant locking/unlocking of any flash block with zero-latency
? A 128-bit protection register that enables unique device identification,
to meet the needs ofnext generation portable applications.
? Improved 12 V production programming for increased factory throughput.
Product Features
■ Flash Memory Plus SRAM
—Reduces Memory Board Space
Required, Simplifying PCB Design
Complexity
■ SCSP Technology
—Smallest Memory Subsystem Footprint
—Area : 8 x 10 mm for 16 Mbit (0.13 μm)
Flash + 2 Mbit or 4 Mbit SRAM
—Area : 8 x 12 mm for 32 Mbit (0.13 μm)
Flash + 4 Mbit or 8 Mbit SRAM
—Height : 1.20 mm for 16 Mbit (0.13 μm)
Flash + 2 Mbit or 4 Mbit SRAM, and 32
Mbit (0.13um) Flash + 8 Mbit SRAM
—Height : 1.40 mm for 32 Mbit (0.13 μm)
Flash + 4 Mbit SRAM
—This Family also includes 0.25 μm, 0.18
μm, and 0.13 μm technologies
■ Advanced SRAM Technology
—70 ns Access Time
—Low Power Operation
—Low Voltage Data Retention Mode
■ Intel? Flash Data Integrator (FDI) Software
—Real-Time Data Storage and Code
Execution in the Same Memory Device
—Full Flash File Manager Capability
■ Advanced+ Boot Block Flash Memory
—70 ns Access Time
—Instant, Individual Block Locking
—128 bit Protection Register
—12 V Production Programming
—Fast Program and Erase Suspend
—Extended Temperature –25 °C to +85 °C
■ Blocking Architecture
—Block Sizes for Code + Data Storage
—4-Kword Parameter Blocks
—64-Kbyte Main Blocks
—100,000 Erase Cycles per Block
■ Low Power Operation
—Asynchronous Read Current: 9 mA (Flash)
—Standby Current: 7 μA (Flash)
—Automatic Power Saving Mode
■ Flash Technologies
—0.25 μm ETOX? VI, 0.18 μm ETOX?
VII and 0.13 μm ETOX? VIII Flash
Technologies
產(chǎn)品屬性
- 型號:
RD28F3208C3B70
- 制造商:
INTEL
- 制造商全稱:
Intel Corporation
- 功能描述:
3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
INTEL/英特爾 |
23+ |
NA/ |
28 |
優(yōu)勢代理渠道,原裝正品,可全系列訂貨開增值稅票 |
詢價 | ||
INTEL |
23+ |
BGA |
8890 |
價格優(yōu)勢/原裝現(xiàn)貨/客戶至上/歡迎廣大客戶來電查詢 |
詢價 | ||
INTEL |
21+ |
BGA |
1523 |
公司現(xiàn)貨,不止網(wǎng)上數(shù)量!原裝正品,假一賠十! |
詢價 | ||
INTEL/英特爾 |
2022 |
BGA |
80000 |
原裝現(xiàn)貨,OEM渠道,歡迎咨詢 |
詢價 | ||
INTEL |
22+23+ |
BGA |
40719 |
絕對原裝正品全新進口深圳現(xiàn)貨 |
詢價 | ||
INTEL |
22+ |
BGA |
4897 |
絕對原裝!現(xiàn)貨熱賣! |
詢價 | ||
INTEL |
23+ |
BGA |
8560 |
受權代理!全新原裝現(xiàn)貨特價熱賣! |
詢價 | ||
INTEL/英特爾 |
2403+ |
BGA |
11809 |
原裝現(xiàn)貨!歡迎隨時咨詢! |
詢價 | ||
INTEL |
19+ |
BGA |
256800 |
原廠代理渠道,每一顆芯片都可追溯原廠; |
詢價 | ||
INTEL |
BGA |
9930 |
集團化配單-有更多數(shù)量-免費送樣-原包裝正品現(xiàn)貨-正規(guī) |
詢價 |