首頁>S25FL128SAGMFIQ03>規(guī)格書詳情

S25FL128SAGMFIQ03中文資料飛索數(shù)據(jù)手冊(cè)PDF規(guī)格書

S25FL128SAGMFIQ03
廠商型號(hào)

S25FL128SAGMFIQ03

功能描述

MirrorBit Flash Non-Volatile Memory CMOS 3.0 Volt Core with Versatile I/O Serial Peripheral Interface with Multi-I/O

文件大小

5.40247 Mbytes

頁面數(shù)量

153

生產(chǎn)廠商 SPANSION
企業(yè)簡稱

spansion飛索

中文名稱

飛索半導(dǎo)體官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-1-7 22:30:00

S25FL128SAGMFIQ03規(guī)格書詳情

General Description

The Spansion S25FL128S and S25FL256S devices are flash non-volatile memory products using:

■ MirrorBit technology - that stores two data bits in each memory array transistor

■ Eclipse architecture - that dramatically improves program and erase performance

■ 65 nm process lithography

This family of devices connect to a host system via a Serial Peripheral Interface (SPI). Traditional SPI single bit serial input and output (SIngle I/O or SIO) is supported as well as optional two bit (Dual I/O or DIO) and four bit (Quad I/O or QIO) serial commands. This multiple width interface is called SPI Multi-I/O or MIO. In addition, the FL-S family adds support for Double Data Rate (DDR) read commands for SIO, DIO, and QIO that transfer address and read data on both edges of the clock.

The Eclipse architecture features a Page Programming Buffer that allows up to 128 words (256 bytes) or 256 words (512 bytes) to be programmed in one operation, resulting in faster effective programming and erase than prior generation SPI program or erase algorithms.

Executing code directly from flash memory is often called Execute-In-Place or XIP. By using FL-S devices at the higher clock rates supported, with QIO or DDR-QIO commands, the instruction read transfer rate can match or exceed traditional parallel interface, asynchronous, NOR flash memories while reducing signal count dramatically.

The S25FL128S and S25FL256S products offer high densities coupled with the flexibility and fast performance required by a variety of embedded applications. They are ideal for code shadowing, XIP, and data storage.

Features

■ Density

– 128 Mbits (16 Mbytes)

– 256 Mbits (32 Mbytes)

■ Serial Peripheral Interface (SPI)

– SPI Clock polarity and phase modes 0 and 3

– Double Data Rate (DDR) option

– Extended Addressing: 24- or 32-bit address options

– Serial Command set and footprint compatible with S25FL-A,

S25FL-K, and S25FL-P SPI families

– Multi I/O Command set and footprint compatible with

S25FL-P SPI family

■ READ Commands

– Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR

– AutoBoot - power up or reset and execute a Normal or Quad read

command automatically at a preselected address

– Common Flash Interface (CFI) data for configuration information.

■ Programming (1.5 Mbytes/s)

– 256 or 512 Byte Page Programming buffer options

– Quad-Input Page Programming (QPP) for slow clock systems

■ Erase (0.5 to 0.65 Mbytes/s)

– Hybrid sector size option - physical set of thirty two 4-kbyte sectors

at top or bottom of address space with all remaining sectors of

64 kbytes, for compatibility with prior generation S25FL devices

– Uniform sector option - always erase 256-kbyte blocks for software

compatibility with higher density and future devices.

■ Cycling Endurance

– 100,000 Program-Erase Cycles on any sector typical

■ Data Retention

– 20 Year Data Retention typical

■ Security features

– One Time Program (OTP) array of 1024 bytes

– Block Protection:

– Status Register bits to control protection against program or

erase of a contiguous range of sectors.

– Hardware and software control options

– Advanced Sector Protection (ASP)

– Individual sector protection controlled by boot code or password

■ Spansion? 65 nm MirrorBit Technology with Eclipse? Architecture

■ Core Supply Voltage: 2.7V to 3.6V

■ I/O Supply Voltage: 1.65V to 3.6V

– SO16 and FBGA packages

■ Temperature Range:

– Industrial (-40°C to +85°C)

– Automotive In-Cabin (-40°C to +105°C)

■ Packages (all Pb-free)

– 16-lead SOIC (300 mil)

– WSON 6 x 8 mm

– BGA-24 6 x 8 mm

– 5 x 5 ball (FAB024) and 4 x 6 ball (FAC024) footprint options

– Known Good Die and Known Tested Die

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫存 備注 價(jià)格
SPANSIO
2020+
SOP16
80000
只做自己庫存,全新原裝進(jìn)口正品假一賠百,可開13%增
詢價(jià)
Cypress(賽普拉斯)
23+
NA/
8735
原廠直銷,現(xiàn)貨供應(yīng),賬期支持!
詢價(jià)
Infineon Technologies
23+/24+
16-SOIC
8600
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨
詢價(jià)
SPANSION
24+
SOP16
12000
專營SPANSION進(jìn)口原裝正品假一賠十可開17%增值稅票
詢價(jià)
6000
詢價(jià)
CYPRESS/賽普拉斯
2019
480
原裝現(xiàn)貨支持BOM配單服務(wù)
詢價(jià)
SPANSION(飛索)
2021+
SOIC-16
499
詢價(jià)
CYPRESS SEMICONDUCTOR
22+
SMD
518000
明嘉萊只做原裝正品現(xiàn)貨
詢價(jià)
Cypress
23+
NA
10726
專做原裝正品,假一罰百!
詢價(jià)
Spansion
23+
SOP16
6200
絕對(duì)全新原裝!優(yōu)勢(shì)供貨渠道!特價(jià)!請(qǐng)放心訂購!
詢價(jià)