S70KL1283集成電路（IC）的存儲(chǔ)器規(guī)格書(shū)PDF中文資料

Features

? Interface

- xSPI (Octal) interface

- 1.8 V / 3.0 V interface support

? Single ended clock (CK) - 11 bus signals

? Optional differential clock (CK, CK#) - 12 bus signals

- Chip Select (CS#)

- 8-bit data bus (DQ[7:0])

- Hardware reset (RESET#)

- Bidirectional read-write data strobe (RWDS)

? Output at the start of all transactions to indicate refresh latency

? Output during read transactions as read data strobe

? Input during write transactions as write data mask

- Optional DDR center-aligned read strobe (DCARS)

? During read transactions RWDS is offset by a second clock, phase shifted from CK

? The phase shifted clock is used to move the RWDS transition edge within the read data eye

? Performance, power, and packages

- 200-MHz maximum clock rate

- DDR transfers data on both edges of the clock

- Data throughput up to 400 MBps (3,200 Mbps)

- Configurable burst characteristics

? Linear burst

? Wrapped burst lengths:

16 bytes (8 clocks)

32 bytes (16 clocks)

64 bytes (32 clocks)

128 bytes (64 clocks)

? Hybrid option - one wrapped burst followed by linear burst on 64 Mb. Linear burst across die boundary is

not supported.

- Configurable output drive strength

- Power modes[1]

? Hybrid Sleep mode

? Deep Power Down

- Array refresh

? Partial memory array (1/8, 1/4, 1/2, and so on)

? Full

- Package

? 24-ball FBGA

- Operating temperature range

? Industrial (I): –40°C to +85°C

? Industrial Plus (V): –40°C to +105°C

? Automotive, AEC-Q100 Grade 3: –40°C to +85°C

? Automotive, AEC-Q100 Grade 2: –40°C to +105°C

? Technology

- 38-nm DRAM