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S70WS512N00BFWA32中文資料飛索數(shù)據(jù)手冊PDF規(guī)格書
廠商型號 |
S70WS512N00BFWA32 |
功能描述 | Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
文件大小 |
1.04414 Mbytes |
頁面數(shù)量 |
93 頁 |
生產(chǎn)廠商 | SPANSION |
企業(yè)簡稱 |
spansion【飛索】 |
中文名稱 | 飛索半導(dǎo)體官網(wǎng) |
原廠標(biāo)識 | |
數(shù)據(jù)手冊 | |
更新時間 | 2024-12-28 23:00:00 |
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S70WS512N00BFWA32規(guī)格書詳情
General Description
The S70WS512N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of two S29WS-N flash memory die.
Distinctive Characteristics
MCP Features
■ Power supply voltage of 1.7 V to 1.95 V
■ Burst Speed: 54 MHz, 66 MHz
■ Package
— 8 x 11.6 mm
■ Operating Temperature
— Wireless, –25°C to +85°C
產(chǎn)品屬性
- 型號:
S70WS512N00BFWA32
- 制造商:
SPANSION
- 制造商全稱:
SPANSION
- 功能描述:
Same-Die Stacked Multi-Chip Product(MCP) 512 Megabit(32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
PERIPHERAL |
23+ |
NA/ |
3265 |
原廠直銷,現(xiàn)貨供應(yīng),賬期支持! |
詢價 | ||
TDK |
23+ |
QFP64 |
20000 |
全新原裝假一賠十 |
詢價 | ||
IPAIRGAIN |
24+ |
BGA |
35200 |
一級代理/放心采購 |
詢價 | ||
SAMSUNG |
17+ |
CSP30 |
1000 |
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力 |
詢價 | ||
TDK |
98+ |
QFP64 |
1335 |
全新原裝進(jìn)口自己庫存優(yōu)勢 |
詢價 | ||
ST |
BGA |
93480 |
集團(tuán)化配單-有更多數(shù)量-免費送樣-原包裝正品現(xiàn)貨-正規(guī) |
詢價 | |||
SAMSUNG |
589220 |
16余年資質(zhì) 絕對原盒原盤 更多數(shù)量 |
詢價 | ||||
24+ |
3000 |
自己現(xiàn)貨 |
詢價 | ||||
ST |
23+ |
BGA |
16900 |
正規(guī)渠道,只有原裝! |
詢價 | ||
ST |
22+ |
BGA |
16900 |
支持樣品 原裝現(xiàn)貨 提供技術(shù)支持! |
詢價 |