首頁 >TESST12V0AA>規(guī)格書列表
零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Lowleakagecurrent. -Lowclampingvoltage. -UltrasmallSMDpackage:0201. -AEC-Q101Qualified. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Lowleakagecurrent. -Lowclampingvoltage. -UltrasmallSMDpackage:0201. -AEC-Q101Qualified. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features Uni-directionalESDprotection IEC61000-4-215kV(contact),20kV(air). Workingvoltage:5V UltrasmallSMDpackage:0503. Highcomponentdensity. Mechanicaldata Case:0503(1308)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-7 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Uni-directionalESDprotection -UltrasmallSMDpackage:0503. -Highcomponentdensity. Mechanicaldata -Case:0503/SOD-523FStandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:Cathode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Uni-diretionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:Cathodeband&E12 -Mountingposition: | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Uni-directionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:Cathodeband&am | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Lowclampingvoltage. -LowLeakagecurrent. -ProtectsoneI/Oline. -Workingvoltages:3.3V~36V. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode -Workingvoltages:2.5V~15V. -Lowleakagecurrent. -ProtectsonedirectionalI/Oline. -Lowclampingvoltage. -IEC61000-4-2Level4ESDprotection. Features | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -IEC61000-4-2Level4ESDprotection. -ESDRatingofClass3(>16kV)perHumanBodyMode. -Lowbodyheight:0.017”(0.43mm) -LowLeakage Mechanicaldata -Epoxy:MeetsUL94V-0 -Case:0402/SOD-923Fsmalloutlineplasticpackage.moldedplastic. -Terminals:Mattetinplated,so | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Lowleakagecurrent. -Lowclampingvoltage. -UltrasmallSMDpackage. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Uni-diretionalESDprotection. -Surfacemountpackage. -UltrasmallSMDpackage:0402. -Highcomponentdensity. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:Cathodeban | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Uni-directionalESDprotection. -Surfacemountpackage. -UltrasmallSMDpackage:0402. -Highcomponentdensity. Mechanicaldata -Case:0402/SOD-923standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -IEC61000-4-2Level4ESDprotection. -ESDRatingofClass3perHumanBodyMode. -LowLeakage -ResponseTimeisTypically Mechanicaldata -Case:0402/SOD-882smalloutlineplasticpackage. -Terminals:Mattetinplated,solderableperMIL-STD-750, | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features Uni-diretionalESDprotection. (16kV)IEC61000-4-2rating. Surfacemountpackage. Highcomponentdensity. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. MarkingCode:Cathode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Uni-directionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -Mountingposition:Any. -Wei | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
LowCapacitanceSMDESDProtectionDiode RoHSDevice HalogenFree Features -ProtectsoneBi-directionalI/Oline -WorkingVoltage:3V,3.3V,5V,8V,12V,15V,24V -Lowclampingvoltage -IEC61000-4-2Level4ESDProtection. -IEC61000-4-4Level4FETprotection. -IEC61000-4-5(Lightning)rating.12A(8/20μS) Mechanicaldata -Cas | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Uni-directionalESDprotection. -Lowleakagecurrent. -Lowclampingvoltage. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Lowleakagecurrent. -Lowclampingvoltage. -UltrasmallSMDpackage:0201. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Lowleakagecurrent. -Lowclampingvoltage. -UltrasmallSMDpackage:0201. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
TIP-TEK |
22+ |
SOD-323 |
9600 |
原裝現(xiàn)貨,優(yōu)勢供應(yīng),支持實(shí)單! |
詢價 | ||
TIP-TEK |
23+ |
SOD-323 |
39000 |
原裝正品現(xiàn)貨 |
詢價 | ||
TIP-TEK |
23+ |
SOD-323 |
50000 |
原裝正品 支持實(shí)單 |
詢價 | ||
NECTOKIN |
2022+ |
719 |
全新原裝 貨期兩周 |
詢價 | |||
24+ |
SMD |
497 |
本站現(xiàn)庫存 |
詢價 | |||
ST |
24+ |
SO-8 |
7500 |
十年品牌!原裝現(xiàn)貨!!! |
詢價 | ||
TEST |
新 |
8 |
全新原裝 貨期兩周 |
詢價 | |||
MAXIM |
22+23+ |
QFN40 |
29901 |
絕對原裝正品全新進(jìn)口深圳現(xiàn)貨 |
詢價 | ||
MAXIM/美信 |
24+ |
QFN40 |
1196 |
原裝現(xiàn)貨假一賠十 |
詢價 | ||
ADI/亞德諾 |
2023+ |
SMD |
6895 |
原廠全新正品旗艦店優(yōu)勢現(xiàn)貨 |
詢價 |
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