零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
NeonIndicatiors(Neon,LEDandFilamentLamps) | BULGIN BULGIN COMPONENTS PLC | BULGIN | ||
InductiveSensors | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團(tuán) | Balluff | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Termi | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Te | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. (IR=0.1uAtyp.@VR=10V) -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedpla | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,method2 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Te | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. - | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
null8-bitWithstandVoltageMicrocontroller | ONSEMION Semiconductor 安森美半導(dǎo)體安森美半導(dǎo)體公司 | ONSEMI | ||
SMTPOWERINDUCTORSToroid-BobcatSeries | pulse Pulse A Technitrol Company | pulse | ||
SMTPOWERINDUCTORS | pulse Pulse A Technitrol Company | pulse | ||
SMTPOWERINDUCTORSToroid-BobcatSeries | pulse Pulse A Technitrol Company | pulse | ||
SMTPOWERINDUCTORS | pulse Pulse A Technitrol Company | pulse | ||
SMTPOWERINDUCTORS | pulse Pulse A Technitrol Company | pulse | ||
Microcontroller | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
120-MHz,32-bitRXMCU,on-chipFPU,240DMIPS,upto1-MBflashmemory, | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS |
詳細(xì)參數(shù)
- 型號(hào):
VXD0145
- 制造商:
Panasonic Industrial Company
- 功能描述:
BRACKET
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
Microchip |
21+ |
UM-1 |
15000 |
只做原裝 |
詢價(jià) | ||
microchip |
23+ |
UM-1 |
15422 |
原包裝原標(biāo)現(xiàn)貨,假一罰十, |
詢價(jià) | ||
SMCCorporation |
新 |
5 |
全新原裝 貨期兩周 |
詢價(jià) | |||
SMC Corporation |
2022+ |
1 |
全新原裝 貨期兩周 |
詢價(jià) | |||
進(jìn)口原裝 |
23+ |
QFN |
1020 |
優(yōu)勢(shì)庫(kù)存 |
詢價(jià) | ||
Microchip |
140 |
只做正品 |
詢價(jià) |
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