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WED2ZLRSP01S50BC中文資料WEDC數(shù)據(jù)手冊PDF規(guī)格書

WED2ZLRSP01S50BC
廠商型號

WED2ZLRSP01S50BC

功能描述

512K x 32/256K x 32 Dual Array Synchronous Pipeline Burst NBL SRAM

文件大小

350.39 Kbytes

頁面數(shù)量

13

生產(chǎn)廠商 White Electronic Designs Corporation
企業(yè)簡稱

WEDC

中文名稱

White Electronic Designs Corporation

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二

更新時(shí)間

2025-1-26 9:48:00

WED2ZLRSP01S50BC規(guī)格書詳情

DESCRIPTION

The WED2ZLRSP01S, Dual Independent Array, NBL-SSRAM device employs high-speed, Low-Power CMOS silicon and is fabricated using an advanced CMOS process. WEDC’s 24Mb, Sync Burst SRAM MCP integrates two totally independent arrays, the fi rst organized as a 512K x 32, and the second a 256K x 32.

FEATURES

■ Fast clock speed: 166, 150, 133, and 100MHz

■ Fast access times: 3.5ns, 3.8ns, 4.2ns, and 5.0ns

■ Fast OE# access times: 3.5ns, 3.8ns, 4.2ns, and 5.0ns

■ Single +2.5V ± 5 power supply (VCC)

■ Snooze Mode for reduced-standby power

■ Individual Byte Write control

■ Clock-controlled and registered addresses, data I/Os and control signals

■ Burst control (interleaved or linear burst)

■ Packaging:

■ 209-bump BGA package

■ Low capacitive bus loading

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價(jià)格
WEDC
23+
NA
50000
全新原裝正品現(xiàn)貨,支持訂貨
詢價(jià)
WEDC
23+
BGA
3000
一級代理原廠VIP渠道,專注軍工、汽車、醫(yī)療、工業(yè)、
詢價(jià)
WEDC
24+
BGA
35210
原裝現(xiàn)貨/放心購買
詢價(jià)
WED
23+
BGA
1733
專業(yè)優(yōu)勢供應(yīng)
詢價(jià)
2023+
3000
進(jìn)口原裝現(xiàn)貨
詢價(jià)
WEDC
22+
BGA
50000
只做原裝正品,假一罰十,歡迎咨詢
詢價(jià)
WEDC
2318+
BGA
5620
十年專業(yè)專注 優(yōu)勢渠道商正品保證公司現(xiàn)貨
詢價(jià)
WED
2022+
BGA119
57550
詢價(jià)
Microsemi(美高森美)
23+
CBGA255
7350
現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費(fèi)送樣,原廠技術(shù)支持!!!
詢價(jià)
WEDC
21+
BGA
645
航宇科工半導(dǎo)體-央企合格優(yōu)秀供方!
詢價(jià)