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零件編號(hào)	下載&訂購(gòu)	功能描述	制造商&上傳企業(yè)	LOGO
CDBFR0130	文件：75.86 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated,solderable	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130	文件：268.92 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solde	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130-HF	文件：268.92 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solde	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130L-HF	文件：130.22 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA RoHSDevice HalogenFree VR=30Volts Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130R	文件：130.33 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage moldedplastic. -Terminals:Goldplated,solder	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130R-HF	文件：130.72 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBN0130	文件：56.01 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method20	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130L	文件：107.75 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode IO=100mA VR=30V RoHSDevice Features -Smallsurfacemountingtype. -Highreliability. MechanicalData -Case:MoldedplasticSOD-723 -Terminals:SolderableperMIL-STD-750,Method2026.1. -Polarity:Indicatedbycathodeband. -Mountingposition:Any.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130L	文件：107.75 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130L-G	文件：51.88 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode ReverseVoltage:30Volts ForwardCurrent:100mA Features: ?SmallSurfaceMountingType ?HighReliability MechanicalData: ?Case:MoldedplasticSOD-723 ?Terminals:SolderableperMIL-STD-750,Method2026.1. ?Polarity:Indicatedbycathodeband. ?Mountingposition:Any. ?Marking:	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130R	文件：68.76 Kbytes Page：2 Pages	SMDSchottkyBarrlierDiode IO=100mA VR=30V RoHSDevice Features -Smallsurfacemountingtype. -Lowreversecurrentandlowforwardvoltage. -Highreliability. MechanicalData -Case:MoldedplasticSOD-723 -Terminals:SolderableperMIL-STD-750,Method2026.1. -Polarity:Indicatedbycathodeband. -Mountin	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130R-G	文件：52 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode ReverseVoltage:30Volts ForwardCurrent:100mA Features: ?SmallSurfaceMountingType ?LowReverseCurrentandLowForwardVoltage. ?HighReliability MechanicalData: ?Case:MoldedplasticSOD-723 ?Terminals:SolderableperMIL-STD-750,Method2026.1. ?Polarity:Indicatedbycath	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0130L-HF	文件：106.64 Kbytes Page：4 Pages	LowVFSMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0130R-HF	文件：469.34 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130L	文件：200.44 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130L-HF	文件：201.65 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130R	文件：200.98 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowreversecurrent Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-ST	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130R-HF	文件：199.99 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBS0130	文件：147.9 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBS0130	文件：61.59 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

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供應(yīng)商	型號(hào)	品牌	批號(hào)	封裝	庫(kù)存	備注	價(jià)格
深圳市威爾健半導(dǎo)體有限公司	CDBF0130整流器件	COMCHIP/典琦科技	23+	1005SOD-3	50000	全新原裝正品現(xiàn)貨,支持訂貨	詢價(jià)
深圳廊盛科技有限公司	CDBF0130整流器件	COMCHIP/典琦科技	23+	1005SOD-3	20000	原裝正品歡迎咨詢	詢價(jià)
深圳市博浩通科技有限公司	CDBF0140L	COMCHIP	23+	1005	7750	全新原裝優(yōu)勢(shì)	詢價(jià)
深圳市得捷芯城科技有限公司	CDBF0140L	COMCHIP/典琦科技	23+	NA/	200	優(yōu)勢(shì)代理渠道,原裝正品,可全系列訂貨開(kāi)增值稅票	詢價(jià)
深圳誠(chéng)思涵科技有限公司	CDBF0140L-HF	COMCHIP	16+	SOD	252000	鍏ㄦ柊鍘熻鐜拌揣/浠鋒牸鍙皥!	詢價(jià)
中天科工半導(dǎo)體（深圳）有限公司	CDBF0140L-HF	COMCHIP	20+	SOD	36800	原裝優(yōu)勢(shì)主營(yíng)型號(hào)-可開(kāi)原型號(hào)增稅票	詢價(jià)
深圳市維爾達(dá)電子有限公司	CDBF0140L-HF	COMCHIP	2023+	SOD	80000	一級(jí)代理/分銷渠道價(jià)格優(yōu)勢(shì) 十年芯程一路只做原裝正品	詢價(jià)
瀚佳科技(深圳)有限公司	CDBF0140L-HF	COMCHIP	24+	SOD	18800	絕對(duì)原裝進(jìn)口現(xiàn)貨,假一賠十,價(jià)格優(yōu)勢(shì)!	詢價(jià)
深圳市科雨電子有限公司	CDBF0140L-HF	COMCHIP	1809+	SOD-323	16750	就找我吧!--邀您體驗(yàn)愉快問(wèn)購(gòu)元件!	詢價(jià)
深圳市易訊博科技有限公司	CDBF0140L-HF	Comchip	22+	NA	75	加我QQ或微信咨詢更多詳細(xì)信息,	詢價(jià)

更多CDBF0130整流器件供應(yīng)商更新時(shí)間2025-1-5 11:00:00

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