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IDT71V3557S75BQ集成電路(IC)的存儲器規(guī)格書PDF中文資料

IDT71V3557S75BQ
廠商型號

IDT71V3557S75BQ

參數(shù)屬性

IDT71V3557S75BQ 封裝/外殼為165-TBGA;包裝為托盤;類別為集成電路(IC)的存儲器;產(chǎn)品描述:IC SRAM 4.5MBIT PAR 165CABGA

功能描述

128K x 36, 256K x 18, 3.3V Synchronous ZBT SRAMs 3.3V I/O, Burst Counter, Flow-Through Outputs

封裝外殼

165-TBGA

文件大小

996.97 Kbytes

頁面數(shù)量

28

生產(chǎn)廠商 Integrated Device Technology, Inc.
企業(yè)簡稱

IDT

中文名稱

Integrated Device Technology, Inc.官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-3-10 16:11:00

人工找貨

IDT71V3557S75BQ價格和庫存,歡迎聯(lián)系客服免費(fèi)人工找貨

IDT71V3557S75BQ規(guī)格書詳情

Description

The IDT71V3557/59 are 3.3V high-speed 4,718,592-bit (4.5 Mega-bit) synchronous SRAMs organized as 128K x 36/256K x 18. They are designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus they have been given the name ZBTTM, or Zero Bus Turnaround.

Features

◆ 128K x 36, 256K x 18 memory configurations

◆ Supports high performance system speed - 100 MHz (7.5 ns Clock-to-Data Access)

◆ ZBTTM Feature - No dead cycles between write and read cycles

◆ Internally synchronized output buffer enable eliminates the need to control OE

◆ Single R/W (READ/WRITE) control pin

◆ 4-word burst capability (Interleaved or linear)

◆ Individual byte write (BW1 - BW4) control (May tie active)

◆ Three chip enables for simple depth expansion

◆ 3.3V power supply (±5), 3.3V (±5) I/O Supply (VDDQ)

◆ Optional Boundary Scan JTAG Interface (IEEE 1149.1 complaint)

◆ Packaged in a JEDEC Standard 100-pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball grid array (fBGA)

產(chǎn)品屬性

  • 產(chǎn)品編號:

    IDT71V3557S75BQ

  • 制造商:

    Renesas Electronics America Inc

  • 類別:

    集成電路(IC) > 存儲器

  • 包裝:

    托盤

  • 存儲器類型:

    易失

  • 存儲器格式:

    SRAM

  • 技術(shù):

    SRAM - 同步,SDR(ZBT)

  • 存儲容量:

    4.5Mb(128K x 36)

  • 存儲器接口:

    并聯(lián)

  • 電壓 - 供電:

    3.135V ~ 3.465V

  • 工作溫度:

    0°C ~ 70°C(TA)

  • 安裝類型:

    表面貼裝型

  • 封裝/外殼:

    165-TBGA

  • 供應(yīng)商器件封裝:

    165-CABGA(13x15)

  • 描述:

    IC SRAM 4.5MBIT PAR 165CABGA

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
IDT
24+
QFP
2650
原裝優(yōu)勢!絕對公司現(xiàn)貨
詢價
IDT
23+
QFP
3200
全新原裝、誠信經(jīng)營、公司現(xiàn)貨銷售
詢價
IDT
23+
165FPBGA
9526
詢價
Renesas Electronics Corporatio
23+/24+
165-TBGA
8600
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨
詢價
IDT
23+
QFP
98900
原廠原裝正品現(xiàn)貨!!
詢價
IDT
22+
NA
4500
全新原裝品牌專營
詢價
05+
原廠原裝
4360
只做全新原裝真實(shí)現(xiàn)貨供應(yīng)
詢價
IDT
23+
TQFP-100
1186
全新原裝
詢價
IDT, Integrated Device Technol
24+
165-CABGA(13x15)
56200
一級代理/放心采購
詢價
IDT
2021+
1218
十年專營原裝現(xiàn)貨,假一賠十
詢價