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IS61NLP102418-200B3集成電路(IC)存儲器規(guī)格書PDF中文資料
廠商型號 |
IS61NLP102418-200B3 |
參數(shù)屬性 | IS61NLP102418-200B3 封裝/外殼為165-TBGA;包裝為托盤;類別為集成電路(IC) > 存儲器;產品描述:IC SRAM 18MBIT PARALLEL 165TFBGA |
功能描述 | 256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM |
文件大小 |
277.54 Kbytes |
頁面數(shù)量 |
35 頁 |
生產廠商 | Integrated Silicon Solution Inc |
企業(yè)簡稱 |
ISSI【北京矽成】 |
中文名稱 | 北京矽成半導體有限公司官網 |
原廠標識 | |
數(shù)據(jù)手冊 | |
更新時間 | 2024-11-19 20:00:00 |
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IS61NLP102418-200B3規(guī)格書詳情
DESCRIPTION
The 18 Meg NLP/NVP product family feature high-speed, low-power synchronous static RAMs designed to provide a burstable, high-performance, no wait state, device for networking and communications applications. They are organized as 256K words by 72 bits, 512K words by 36 bits and 1M words by 18 bits, fabricated with ISSIs advanced CMOS technology.
FEATURES
? 100 percent bus utilization
? No wait cycles between Read and Write
? Internal self-timed write cycle
? Individual Byte Write Control
? Single R/W (Read/Write) control pin
? Clock controlled, registered address, data and control
? Interleaved or linear burst sequence control using MODE input
? Three chip enables for simple depth expansion and address pipelining
? Power Down mode
? Common data inputs and data outputs
? CKE pin to enable clock and suspend operation
? JEDEC 100-pin TQFP, 165-ball PBGA and 209- ball (x72) PBGA packages
? Power supply:
NVP: VDD 2.5V (± 5), VDDQ 2.5V (± 5)
NLP: VDD 3.3V (± 5), VDDQ 3.3V/2.5V (± 5)
? JTAG Boundary Scan for PBGA packages
? Industrial temperature available
? Lead-free available
IS61NLP102418-200B3屬于集成電路(IC) > 存儲器。北京矽成半導體有限公司制造生產的IS61NLP102418-200B3存儲器存儲器是集成電路上用作數(shù)據(jù)存儲設備的半導體器件。這些器件分為非易失性或易失性兩種,格式包括 CBRAM、DRAM、EEPROM、EERAM、EPROM、閃存、FRAM、NVSRAM、PCM (PRAM)、PSRAM、RAM 和 SRAM。這些器件的存儲容量為 64 b 至 6 Tb 不等,接口有 I2C、MMC、并行、eMMC、串行、單線、SPI、UFS、Xccela 總線和 1-線。
產品屬性
更多- 產品編號:
IS61NLP102418-200B3
- 制造商:
ISSI, Integrated Silicon Solution Inc
- 類別:
集成電路(IC) > 存儲器
- 包裝:
托盤
- 存儲器類型:
易失
- 存儲器格式:
SRAM
- 技術:
SRAM - 同步,SDR
- 存儲容量:
18Mb(1M x 18)
- 存儲器接口:
并聯(lián)
- 電壓 - 供電:
3.135V ~ 3.465V
- 工作溫度:
0°C ~ 70°C(TA)
- 安裝類型:
表面貼裝型
- 封裝/外殼:
165-TBGA
- 供應商器件封裝:
165-TFBGA(13x15)
- 描述:
IC SRAM 18MBIT PARALLEL 165TFBGA
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
ISSI |
23+ |
NA/ |
3423 |
原裝現(xiàn)貨,當天可交貨,原型號開票 |
詢價 | ||
ISSI |
2018+ |
BGA-156 |
6528 |
科恒偉業(yè)!承若只做進口原裝正品假一賠十!1581728776 |
詢價 | ||
ISSI |
21+ |
BGA |
10000 |
原裝現(xiàn)貨假一罰十 |
詢價 | ||
原裝ISSI |
23+ |
BGA |
30000 |
代理原裝現(xiàn)貨,價格優(yōu)勢 |
詢價 | ||
ISSI |
24+ |
BGA |
16000 |
原裝優(yōu)勢絕對有貨 |
詢價 | ||
ISSI |
23+ |
165-PBGA(13x15) |
71890 |
專業(yè)分銷產品!原裝正品!價格優(yōu)勢! |
詢價 | ||
ISSI |
2023+ |
BGA |
8635 |
一級代理優(yōu)勢現(xiàn)貨,全新正品直營店 |
詢價 | ||
ISSI Integrated Silicon Soluti |
21+ |
165TFBGA (13x15) |
13880 |
公司只售原裝,支持實單 |
詢價 | ||
ISSI Integrated Silicon Soluti |
22+ |
165TFBGA (13x15) |
9000 |
原廠渠道,現(xiàn)貨配單 |
詢價 | ||
ISSI Integrated Silicon Soluti |
23+/24+ |
165-TBGA |
8600 |
只供原裝進口公司現(xiàn)貨+可訂貨 |
詢價 |