零件編號(hào) | 下載 訂購(gòu) | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
---|---|---|---|---|
NeonIndicatiors(Neon,LEDandFilamentLamps) | BULGIN BULGIN COMPONENTS PLC | BULGIN | ||
InductiveSensors | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團(tuán) | Balluff | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Termi | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Te | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. (IR=0.1uAtyp.@VR=10V) -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedpla | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,method2 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
TOSH |
QFP80 |
94+ |
49 |
全新原裝進(jìn)口自己庫(kù)存優(yōu)勢(shì) |
詢價(jià) | ||
TOSH |
23+ |
QFP80 |
20000 |
全新原裝假一賠十 |
詢價(jià) | ||
TOS |
23+ |
QFP/100 |
7000 |
絕對(duì)全新原裝!100%保質(zhì)量特價(jià)!請(qǐng)放心訂購(gòu)! |
詢價(jià) | ||
TOS |
24+ |
QFP100 |
30 |
詢價(jià) | |||
TOSHIBA |
11+ |
QFP |
8000 |
全新原裝,絕對(duì)正品現(xiàn)貨供應(yīng) |
詢價(jià) | ||
TOSHIBA/東芝 |
23+ |
SOP24 |
11200 |
原廠授權(quán)一級(jí)代理、全球訂貨優(yōu)勢(shì)渠道、可提供一站式BO |
詢價(jià) | ||
TOSHIBA/東芝 |
1948+ |
QFP |
6852 |
只做原裝正品現(xiàn)貨!或訂貨假一賠十! |
詢價(jià) | ||
TOSHIBA |
23+ |
60 |
現(xiàn)貨庫(kù)存 |
詢價(jià) | |||
SEIKOEPSON |
2020+ |
原廠封裝 |
35000 |
100%進(jìn)口原裝正品公司現(xiàn)貨庫(kù)存 |
詢價(jià) | ||
EPSON |
1999 |
QFP |
20 |
原裝現(xiàn)貨海量庫(kù)存歡迎咨詢 |
詢價(jià) |
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