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WED3C7410E16M450BH9I中文資料WEDC數(shù)據(jù)手冊PDF規(guī)格書

WED3C7410E16M450BH9I
廠商型號

WED3C7410E16M450BH9I

功能描述

7410E RISC Microprocessor HiTCETM Multichip Package

文件大小

456.62 Kbytes

頁面數(shù)量

15

生產(chǎn)廠商 White Electronic Designs Corporation
企業(yè)簡稱

WEDC

中文名稱

White Electronic Designs Corporation

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二

更新時間

2025-1-26 8:00:00

WED3C7410E16M450BH9I規(guī)格書詳情

OVERVIEW

The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.

The WED3C7410E16M-XBHX multichip package consists of:

■ 7410E AltiVec? RISC processor

■ Dedicated 2MB SSRAM L2 cache, confi gured as 256Kx72

■ 21mmx25mm, 255 HiTCE? Ball Grid Array (CBGA)

■ Core frequency = 450 or 400MHz @ 1.8V

■ Maximum L2 Cache frequency = 200MHz

■ Maximum 60x Bus frequency = 100MHz

FEATURES

■ Footprint compatible with WED3C7410E16M-XBX, WED3C7558M-XBX and WED3C750A8M-200BX

■ Implementation of Altivec? technology instruction set

■ Optional, high-bandwidth MPX bus interface

■ HiTCE? interposer for TCE compatibility to laminate substrates for increased Board level reliability

■ Available with eutectic or high lead solder balls

產(chǎn)品屬性

  • 型號:

    WED3C7410E16M450BH9I

  • 制造商:

    WEDC

  • 制造商全稱:

    White Electronic Designs Corporation

  • 功能描述:

    7410E RISC Microprocessor HiTCETM Multichip Package

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
WEDC
21+
BGA
645
航宇科工半導(dǎo)體-央企合格優(yōu)秀供方!
詢價
Microsemi(美高森美)
23+
CBGA255
7350
現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費送樣,原廠技術(shù)支持!!!
詢價
WEDC
23+
NA/
3268
原裝現(xiàn)貨,當(dāng)天可交貨,原型號開票
詢價
WEDC
QQ咨詢
BGA
66
全新原裝 研究所指定供貨商
詢價
WEDC
24+
BGA
35210
原裝現(xiàn)貨/放心購買
詢價
MSC
18+
N/A
85600
保證進口原裝可開17%增值稅發(fā)票
詢價
WEDC
2021+
20
100500
一級代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長期排單到貨
詢價
微芯/美高森美
22+
NA
500000
萬三科技,秉承原裝,購芯無憂
詢價
WED
23+
BGA
1733
專業(yè)優(yōu)勢供應(yīng)
詢價
WEDC
2318+
BGA
5620
十年專業(yè)專注 優(yōu)勢渠道商正品保證公司現(xiàn)貨
詢價