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WED3C7410E16M450BHC中文資料WEDC數(shù)據(jù)手冊(cè)PDF規(guī)格書

WED3C7410E16M450BHC
廠商型號(hào)

WED3C7410E16M450BHC

功能描述

7410E RISC Microprocessor HiTCETM Multichip Package

文件大小

456.62 Kbytes

頁面數(shù)量

15

生產(chǎn)廠商 White Electronic Designs Corporation
企業(yè)簡(jiǎn)稱

WEDC

中文名稱

White Electronic Designs Corporation

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二

更新時(shí)間

2025-1-25 16:30:00

WED3C7410E16M450BHC規(guī)格書詳情

OVERVIEW

The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.

The WED3C7410E16M-XBHX multichip package consists of:

■ 7410E AltiVec? RISC processor

■ Dedicated 2MB SSRAM L2 cache, confi gured as 256Kx72

■ 21mmx25mm, 255 HiTCE? Ball Grid Array (CBGA)

■ Core frequency = 450 or 400MHz @ 1.8V

■ Maximum L2 Cache frequency = 200MHz

■ Maximum 60x Bus frequency = 100MHz

FEATURES

■ Footprint compatible with WED3C7410E16M-XBX, WED3C7558M-XBX and WED3C750A8M-200BX

■ Implementation of Altivec? technology instruction set

■ Optional, high-bandwidth MPX bus interface

■ HiTCE? interposer for TCE compatibility to laminate substrates for increased Board level reliability

■ Available with eutectic or high lead solder balls

產(chǎn)品屬性

  • 型號(hào):

    WED3C7410E16M450BHC

  • 制造商:

    WEDC

  • 制造商全稱:

    White Electronic Designs Corporation

  • 功能描述:

    7410E RISC Microprocessor HiTCETM Multichip Package

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
WEDC
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66
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35210
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微芯/美高森美
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645
航宇科工半導(dǎo)體-央企合格優(yōu)秀供方!
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2022+
BGA119
57550
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