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IS61NLP102418-250B3I集成電路(IC)的存儲(chǔ)器規(guī)格書(shū)PDF中文資料

IS61NLP102418-250B3I
廠商型號(hào)

IS61NLP102418-250B3I

參數(shù)屬性

IS61NLP102418-250B3I 封裝/外殼為165-TBGA;包裝為托盤(pán);類(lèi)別為集成電路(IC)的存儲(chǔ)器;產(chǎn)品描述:IC SRAM 18MBIT PARALLEL 165TFBGA

功能描述

256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM

文件大小

277.54 Kbytes

頁(yè)面數(shù)量

35 頁(yè)

生產(chǎn)廠商 Integrated Silicon Solution Inc
企業(yè)簡(jiǎn)稱(chēng)

ISSI北京矽成

中文名稱(chēng)

北京矽成半導(dǎo)體有限公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二

更新時(shí)間

2025-1-5 16:30:00

IS61NLP102418-250B3I規(guī)格書(shū)詳情

DESCRIPTION

The 18 Meg NLP/NVP product family feature high-speed, low-power synchronous static RAMs designed to provide a burstable, high-performance, no wait state, device for networking and communications applications. They are organized as 256K words by 72 bits, 512K words by 36 bits and 1M words by 18 bits, fabricated with ISSIs advanced CMOS technology.

FEATURES

? 100 percent bus utilization

? No wait cycles between Read and Write

? Internal self-timed write cycle

? Individual Byte Write Control

? Single R/W (Read/Write) control pin

? Clock controlled, registered address, data and control

? Interleaved or linear burst sequence control using MODE input

? Three chip enables for simple depth expansion and address pipelining

? Power Down mode

? Common data inputs and data outputs

? CKE pin to enable clock and suspend operation

? JEDEC 100-pin TQFP, 165-ball PBGA and 209- ball (x72) PBGA packages

? Power supply:

NVP: VDD 2.5V (± 5), VDDQ 2.5V (± 5)

NLP: VDD 3.3V (± 5), VDDQ 3.3V/2.5V (± 5)

? JTAG Boundary Scan for PBGA packages

? Industrial temperature available

? Lead-free available

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    IS61NLP102418-250B3I

  • 制造商:

    ISSI, Integrated Silicon Solution Inc

  • 類(lèi)別:

    集成電路(IC) > 存儲(chǔ)器

  • 包裝:

    托盤(pán)

  • 存儲(chǔ)器類(lèi)型:

    易失

  • 存儲(chǔ)器格式:

    SRAM

  • 技術(shù):

    SRAM - 同步,SDR

  • 存儲(chǔ)容量:

    18Mb(1M x 18)

  • 存儲(chǔ)器接口:

    并聯(lián)

  • 電壓 - 供電:

    3.135V ~ 3.465V

  • 工作溫度:

    -40°C ~ 85°C(TA)

  • 安裝類(lèi)型:

    表面貼裝型

  • 封裝/外殼:

    165-TBGA

  • 供應(yīng)商器件封裝:

    165-TFBGA(13x15)

  • 描述:

    IC SRAM 18MBIT PARALLEL 165TFBGA

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
ISSI,
21+
25000
原廠原包 深圳現(xiàn)貨 主打品牌 假一賠百 可開(kāi)票!
詢(xún)價(jià)
ISSI Integrated Silicon Soluti
23+/24+
165-TBGA
8600
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨
詢(xún)價(jià)
ISSI
2022+
原廠原包裝
8600
全新原裝 支持表配單 中國(guó)著名電子元器件獨(dú)立分銷(xiāo)
詢(xún)價(jià)
ISSI(美國(guó)芯成)
2117+
TFBGA-165(13x15)
315000
144個(gè)/托盤(pán)一級(jí)代理專(zhuān)營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)
詢(xún)價(jià)
ISSI, Integrated Silicon Solu
23+
165-TFBGA13x15
7300
專(zhuān)注配單,只做原裝進(jìn)口現(xiàn)貨
詢(xún)價(jià)
ISSI, Integrated Silicon Solut
21+
BGA
1000
進(jìn)口原裝!長(zhǎng)期供應(yīng)!絕對(duì)優(yōu)勢(shì)價(jià)格(誠(chéng)信經(jīng)營(yíng)
詢(xún)價(jià)
ISSI
23+
PBGA165
3000
一級(jí)代理原廠VIP渠道,專(zhuān)注軍工、汽車(chē)、醫(yī)療、工業(yè)、
詢(xún)價(jià)
ISSI
24+
BGA-165
16000
原裝優(yōu)勢(shì)絕對(duì)有貨
詢(xún)價(jià)
ISSI
23+
165-PBGA(13x15)
39257
專(zhuān)業(yè)分銷(xiāo)產(chǎn)品!原裝正品!價(jià)格優(yōu)勢(shì)!
詢(xún)價(jià)
ISSI Integrated Silicon Soluti
22+
165TFBGA (13x15)
9000
原廠渠道,現(xiàn)貨配單
詢(xún)價(jià)