首頁(yè)>WED3C7558M300BM>規(guī)格書詳情
WED3C7558M300BM中文資料WEDC數(shù)據(jù)手冊(cè)PDF規(guī)格書
相關(guān)芯片規(guī)格書
更多- WED3C7410E16M450BHM
- WED2ZLRSP01S50BC
- WED3C7410E16M400BH9M
- WED3C7410E16M400BH9I
- WED3C7410E16M-XBX
- WED2ZLRSP01S50BI
- WED3C7410E16M-XBHX
- WED3C7410E16M450BH9M
- WED3C7558M300BC
- WED3C7410E16M400BHM
- WED3C7410E16M450BHI
- WED3C7410E16M450BC
- WED3C7410E16M450BHC
- WED3C7410E16M450BH9C
- WED3C7410E16M400BHI
- WED3C7558M300BI
- WED3C7410E16M400BH9C
- WED3C7410E16M450BM
WED3C7558M300BM規(guī)格書詳情
OVERVIEW
The WEDC 755/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.
The WED3C7558M-XBX multichip package consists of:
■ 755 RISC processor
■ Dedicated 1MB SSRAM L2 cache, confi gured as 128Kx72
■ 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
■ Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz)
■ Maximum 60x Bus frequency = 66MHz
FEATURES
■ Footprint compatible with WED3C750A8M-200BX
■ Footprint compatible with Motorola MPC 745
產(chǎn)品屬性
- 型號(hào)：
WED3C7558M300BM
- 制造商：
WEDC
- 制造商全稱：
White Electronic Designs Corporation
- 功能描述：
RISC Microprocessor Multichip Package
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
WEDC |
23+ |
NA/ |
4250 |
原裝現(xiàn)貨,當(dāng)天可交貨,原型號(hào)開票 |
詢價(jià) | ||
WEDC |
24+ |
BGA |
35210 |
原裝現(xiàn)貨/放心購(gòu)買 |
詢價(jià) | ||
WED |
22+ |
BGA119 |
9852 |
只做原裝正品現(xiàn)貨!或訂貨假一賠十! |
詢價(jià) | ||
WEDC |
QQ咨詢 |
BGA |
188 |
全新原裝 研究所指定供貨商 |
詢價(jià) | ||
WHI |
1535+ |
878 |
詢價(jià) | ||||
3CD |
2022+ |
3cd |
8600 |
英瑞芯只做原裝正品 |
詢價(jià) | ||
WEDC |
18+ |
SOP |
85600 |
保證進(jìn)口原裝可開17%增值稅發(fā)票 |
詢價(jià) | ||
微芯/美高森美 |
22+ |
NA |
500000 |
萬(wàn)三科技,秉承原裝,購(gòu)芯無(wú)憂 |
詢價(jià) | ||
WEDC |
2021+ |
20 |
100500 |
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨 |
詢價(jià) | ||
WEDC |
18 |
BGA |
200 |
進(jìn)口原裝正品優(yōu)勢(shì)供應(yīng) |
詢價(jià) |
