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WED3C755E8M-XBX中文資料WEDC數(shù)據(jù)手冊PDF規(guī)格書
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WED3C755E8M-XBX規(guī)格書詳情
OVERVIEW
The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of:
■ 755 RISC processor (E die revision)
■ Dedicated 1MB SSRAM L2 cache, confi gured as 128Kx72
■ 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
■ Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz)
■ Maximum 60x Bus frequency = 66MHz
FEATURES
The WED3C755E8M-XBX is offered in Commercial (0°C to +70°C), industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, fl ight computers, fi re control systems and rugged critical systems.
■ Footprint compatible with WED3C7558M-XBX and WED3C750A8M-200BX
■ Footprint compatible with Motorola MPC 745
產(chǎn)品屬性
- 型號：
WED3C755E8M-XBX
- 功能描述：
PowerPC
| 供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
WHI |
1535+ |
878 |
詢價 | ||||
WHI |
23+ |
878 |
全新原裝，歡迎來電咨詢 |
詢價 | |||
WHITE |
1923+ |
BGA |
2000 |
自己庫存原裝正品特價出售 |
詢價 | ||
WEDC |
23+ |
BGA |
50000 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢價 | ||
WED |
23+ |
BGA119 |
11200 |
原廠授權(quán)一級代理、全球訂貨優(yōu)勢渠道、可提供一站式BO |
詢價 | ||
WEDC |
24+ |
BGA |
35210 |
原裝現(xiàn)貨/放心購買 |
詢價 | ||
3CD |
2022+ |
3cd |
8600 |
英瑞芯只做原裝正品 |
詢價 | ||
WENGRY |
21+ |
SMD |
6000 |
絕對原裝現(xiàn)貨 |
詢價 | ||
WED |
23+ |
BGA |
1733 |
專業(yè)優(yōu)勢供應 |
詢價 | ||
3CD |
21+ |
3cd |
5000 |
原裝現(xiàn)貨/假一賠十/支持第三方檢驗 |
詢價 |
