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WED3C7558M-XBX中文資料WEDC數(shù)據(jù)手冊PDF規(guī)格書

WED3C7558M-XBX
廠商型號

WED3C7558M-XBX

功能描述

RISC Microprocessor Multichip Package

文件大小

530.54 Kbytes

頁面數(shù)量

13

生產(chǎn)廠商 White Electronic Designs Corporation
企業(yè)簡稱

WEDC

中文名稱

White Electronic Designs Corporation

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二

更新時間

2025-1-25 16:30:00

WED3C7558M-XBX規(guī)格書詳情

OVERVIEW

The WEDC 755/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.

The WED3C7558M-XBX multichip package consists of:

■ 755 RISC processor

■ Dedicated 1MB SSRAM L2 cache, confi gured as 128Kx72

■ 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

■ Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz)

■ Maximum 60x Bus frequency = 66MHz

FEATURES

■ Footprint compatible with WED3C750A8M-200BX

■ Footprint compatible with Motorola MPC 745

產(chǎn)品屬性

  • 型號:

    WED3C7558M-XBX

  • 制造商:

    WEDC

  • 制造商全稱:

    White Electronic Designs Corporation

  • 功能描述:

    RISC Microprocessor Multichip Package

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
WEDC
QQ咨詢
BGA
188
全新原裝 研究所指定供貨商
詢價
WEDC
24+
BGA
35210
原裝現(xiàn)貨/放心購買
詢價
WHI
1535+
878
詢價
3CD
2022+
3cd
8600
英瑞芯只做原裝正品
詢價
WEDC
18+
SOP
85600
保證進(jìn)口原裝可開17%增值稅發(fā)票
詢價
微芯/美高森美
22+
NA
500000
萬三科技,秉承原裝,購芯無憂
詢價
WEDC
2021+
20
100500
一級代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長期排單到貨
詢價
WEDC
18
BGA
200
進(jìn)口原裝正品優(yōu)勢供應(yīng)
詢價
WED
23+
BGA
1733
專業(yè)優(yōu)勢供應(yīng)
詢價
WEDC
2318+
BGA
5620
十年專業(yè)專注 優(yōu)勢渠道商正品保證公司現(xiàn)貨
詢價