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WED3C755E8M350BC中文資料WEDC數(shù)據(jù)手冊(cè)PDF規(guī)格書
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WED3C755E8M350BC規(guī)格書詳情
OVERVIEW
The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of:
■ 755 RISC processor (E die revision)
■ Dedicated 1MB SSRAM L2 cache, confi gured as 128Kx72
■ 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
■ Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz)
■ Maximum 60x Bus frequency = 66MHz
FEATURES
The WED3C755E8M-XBX is offered in Commercial (0°C to +70°C), industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, fl ight computers, fi re control systems and rugged critical systems.
■ Footprint compatible with WED3C7558M-XBX and WED3C750A8M-200BX
■ Footprint compatible with Motorola MPC 745
產(chǎn)品屬性
- 型號(hào)：
WED3C755E8M350BC
- 制造商：
WEDC
- 制造商全稱：
White Electronic Designs Corporation
- 功能描述：
RISC MICROPROCESSOR MULTI-CHIP PACKAGE
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
WEDC |
24+ |
BGA |
35210 |
原裝現(xiàn)貨/放心購(gòu)買 |
詢價(jià) | ||
3CD |
2022+ |
3cd |
8600 |
英瑞芯只做原裝正品 |
詢價(jià) | ||
WEDC |
18+ |
SOP |
85600 |
保證進(jìn)口原裝可開17%增值稅發(fā)票 |
詢價(jià) | ||
微芯/美高森美 |
22+ |
NA |
500000 |
萬(wàn)三科技,秉承原裝,購(gòu)芯無(wú)憂 |
詢價(jià) | ||
WEDC |
2021+ |
20 |
100500 |
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨 |
詢價(jià) | ||
WEDC |
18 |
BGA |
200 |
進(jìn)口原裝正品優(yōu)勢(shì)供應(yīng) |
詢價(jià) | ||
WED |
23+ |
BGA |
1733 |
專業(yè)優(yōu)勢(shì)供應(yīng) |
詢價(jià) | ||
WEDC |
2318+ |
BGA |
5620 |
十年專業(yè)專注 優(yōu)勢(shì)渠道商正品保證公司現(xiàn)貨 |
詢價(jià) | ||
3CD |
21+ |
3cd |
5000 |
原裝現(xiàn)貨/假一賠十/支持第三方檢驗(yàn) |
詢價(jià) | ||
WEDC |
21+ |
BGA |
645 |
航宇科工半導(dǎo)體-央企合格優(yōu)秀供方! |
詢價(jià) |
